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4170-IH     Film Frame Test Handler (MAP Handler

We, Tesec is now introducing the new Map handler model 4170-IH that is for the direct test of the leadless QFN, CSP devices after dicing on the wafer.As the device tesrting is on the wafer ring, and devices positioning(x y z θ)compensation before testing by the visual check system, the high accuracy of the devices positioning informationand the suitable probe-pin contact pressure are maintained for the stable testing and high speed indexing.This new model is upgraded as a succeeding machine of the previous model 3270-IH that improved the transfer accuracy and increased the widthstand load of the test section table, also able to handle the WLCSP as well as comply to multi-testing site and simultaneous (parallel) testing.
  
 
 
FEATURES
・High throughput 
・High withstand load, and high thrust table 
・Expansion of the strip attachment area
 :260(L) X 300(W) [Withinφ300mm for WLCSP]
・LOT control by barcode/2D code reader 
・Easy device type exchange only test socket and
 display screen setting
・Auto-cleaning function unit is installed to
 clean the socket at any desired timing.
・8/12 inches ring conversion 
・S2/S8 regulation compliance
・SEMI G85 compliance
・SECS/GEM compliance 
・Hot temperature test is available : 125C 
 

Model
4170-IH
 Applicable device
QFN, DFN, CSP, BGA, BCC, LLP, WLCSP
Applicable ring sizes
8 / 12 inches
 Test station
Multi-parallel
 Contact method
Pogo-pin or specified contactor
 Supply ring capacity
1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)
Stock ring capacity
1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)
Hot temperature test
MAX 125C
 
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