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History
 

 1969
TES Corporation established in Higashiyamato, Tokyo with a paid-up-capital of JPY 1 million.
Wire Bonder, Discrete Device Tester, and Discrete Device Handler developed.
 1972
Corporate Headquarters moved to Kamikitadai, Higashiyamato, Tokyo.
 1973
Hot Handler for discrete device developed.
 1974
IC Handler developed.
 1975
Thermal Resistance Tester developed.
 1978
Marking Machine developed.
 1980
TES Corporation changed its name to TESEC Corporation.
Ina Factory opened in Minowamachi, Kami-ina, Nagano.
 1981
TESEC EUROPE Office opened in Cergy, France.
Thermal Resistance Tester for GaAsFET developed.
 1982
TESEC USA Office opened in Connecticut, USA.
 1983
TESEC (M) SDN.BHD. opened in Kuala Lumpur Malaysia.
SO/DIP Handler and Laser Marking Machine developed.
 1984
TESEC USA Office changed its name to TESEC, INC.
TESEC SEMICONDUCTOR EQUIPMENT (SINGAPORE) PTE.LTD. opened in Kallang Bahru, Singapore (closed in 2003).
 1985
TESEC EUROPE Office changed its name to TESEC EUROPE S.A.
 1988
Discrete Device Tester controlled with MS-Windows developed.
 1989
SOT23 Integrated System developed.
 1990
High Speed Tri-temp. Handler developed.
 1991
SOP Handler and QFP Handler developed.
 1992
Integrated System for photo-coupler developed.
 1995
Discrete Device Parallel Tester and Integrated System for power devices developed.
 1997
Small Signal Device Tester, High Speed SOT23 Handler, and High Speed QFP Handler developed.
 1999
Obtained ISO9001. (UKAS, RVA)
CSP Handler, MAP System, and IC Tester developed.
 2000
Listed its shares on the over-the-counter market of the Japan Securities Dealers Association (JASDAQ) with a paid-up-capital of JPY 2.5 billion.
SOT23 New Integrated System, and Dynamic Test System developed.
 2001
Expansion of headquarters factory completed..
 2002
Formed business units for each product category by integrating R&D, engineering and sales & marketing groups.
Announced managerial creed and code of conduct.
High Speed TSSOP Handler and High Speed Power Device Handler with Taping Unit developed.
 2003
High Speed CSP MAP Picker developed.
High Speed SOT Handler with Taping Unit developed.
TESEC CHINA (Shanghai) CO., LTD. opened in Shanghai, CHINA.
 2004
TESEC Kumamoto Office opened in Mashiki, Kamimashiki, Kumamoto.
1000th Discrete Device Test System 881-TT shipped.
 2005
Small signal high speed handler developed
 2006
ISO 14001(UKAS) acquisition.
Merged the Tesec Service Corporation.
 2007
High speed picker handler system developed.
 2008
Tesec obtained the Handler business ownership transferring from Yokogawa Electric Corporation.
transferring from Yokogawa Electric Corporation.
 2010
Stock exchange listing is changed from JASDAQ to OSAKA stock exchange bourse due to merger.
OSAKA security exchange Hercules market & JASDAQ stock exchange market.
Stock list on OSAKA JASDAQ (Standard) due to NEO market unification.
Tri-temperature power device handler developed.
 2012
Tesec Inc office (Connecticut/USA) moved to California/USA
 2013Stock is listed on the Tokyo stock exchange bourse JASDAQ (Standard) due to the merger of the Tokyo stock exchange bourse and Osaka stock exchange bourse.
 2014MEMS handler developed.

 
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